Why aFO-PLP can Transform Advanced Semiconductor Packaging
06
Aug
Why aFO-PLP can Transform Advanced Semiconductor Packaging
SCIPTech’s new Additive Fan-Out Panel Level Packaging offers a panel based manufacturing platform based on:
- High speed batch processes
- Significantly lower bill of material and processing costs
- Extremely low lead time toolings
Making it an ideal platform for both low/mid and high volume packaging of semiconductor products
