Enabling Competitive Panel Level Packaging in High Cost Regions

Semiconductor Packaging high volume manufacturing practically disappeared from Europe and the US in the last 30 years. We see a drive for reshoring this key step in semiconductor manufacturing with Advanced Packaging in Porto plant being quite successful, but this plant is focusing on the higher end (from a packaging requirement point of view) market.

The mid and low end market is still not economically feasible to be re-shored to Europe. We see with recent events that the mid and low end market products are still (and will remain for decades to come) vital for our supply chains, and Europe is completely vulnerable and dependable on other regions.

SCIPTech and its partners are working on a new Additive Panel Level Packaging technology that provides a platform for the low and mid end semiconductor market, which is environmentally friendly and ultra low cost and low capex, allowing for semiconductor products to be packaged at a much lower cost compared to state of the art packaging in low cost regions.